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Materials Characterization

Materials Analysis & Characterization Lab Services

Materials analysis and characterization covers a vast array of processes and analytical techniques. The techniques required for characterization are dependent upon the type of material, sample composition, condition, form, and maybe most importantly what information is required. At Advanced MicroAnalytical Analytical, Inc. we listen to our clients and our experience will help ensure we know your process and material, so we can match the right technique and method to your project. The following is a partial list of instrumentation and techniques that are available at Advanced MicroAnalytical for materials analysis and characterization:

Microscopy:

Optical Microscopy: (RL, BF, DF, Transmitted polarized, DIC/NIC, Fluorescence)

Transmission Electron Microscopy: (HR-STEM) with energy-dispersive X-ray spectroscopy (EDS)

Scanning Electron Microscopy -EDS: (Mapping, high mag, quantification, line profiles, etc.)

Specialized Sample Preparation: FIB, Cryo-Microtome, etc.

Chemical Analysis

X-Ray Diffractometers (XRD)
X-ray Fluorescence Spectrometer (WD-XRF)
Fourier Transform Infrared Microscope; Micro FTIR (5 um spot resolution, reflected, transmitted, ATR, mapping, line profiles)
Gas Chromatographs (GC, ECD, FID, MS, MS/MS, NPD, High Resolution, Pyrolisis)
Carbon, Nitrogen, Sulfur, Hydrogen Analyzers (combustion)
Inductively Coupled Plasma Spectrometer (ICP)
Inductively Coupled Plasma Spectrometer/ Mass Spectroscopy (ICP/MS)
Ion Chromatography (IC)
Liquid chromatography–mass spectrometry (LC-MS)
Liquid chromatography-quadrupole mass spectrometer (LC-MS/MS)
High Performance Liquid Chromatography (HPLC)/Diode Array/Fluorescence Detectors
High Performance Liquid Chromatography coupled with ICP-MS (metals speciation)
Mercury Analyzer

Thermal Analysis

Differential Scanning Calorimeter (DSC)
Thermo Gravimetric Analysis (TGA)
Differential Thermal Analysis (DTA)
Dynamic Mechanical Analysis (DMA)

Non-destructive

Real Time Magnified X-ray imaging
High Resolution X-ray film imaging
X-ray CT (computational Tomography)
CSAM (Scanning Acoustic Microscopy)
Portable XRF (Niton type analyzer)
XRF (Plating thickness measurement)

Additional Testing Capabilities

EDM machining
Cryo-Microtome
Environmental Chambers (various conditions)
Heat-treating Furnaces (RT to 1700C)
Zeta Potential Analyzer
Additional Tests (offsite or special arrangement)
Dual Beam FIB (focused ion beam) – Tons of applications
EBSD/EBSD mapping
Serial block tomography imaging (3D reconstruction down to nm scale of volume w/EDS/EBSD compositional analysis)
Tensile stage real-time analysis of strain/compression in SEM
X-Ray Photoelectron Spectroscopy (XPS)
TEM sample preparation and lift out
High Resolution TEM analysis (200KV + and cryoTEM)
Surface Profile/3D reconstruction
Micro Raman (small areas, diamonds, graphene, ceramics)
Atomic Force Microscopy (AFM)